Partitioning of Water between Voids and the Polymer Matrix in a Molymer Compound by Proton NMR: The Role of Larger Voids in the Phenomena Of Popcorning and Delamination

摘要

A single commercial electronic packaging material (EPM), based on a silica-filled cresol-novolac epoxy, was examined in depth in order to provide more general insights into EPMs. This study focuses in voids (defined in this paper as empty regions larger than 4 nm in minimum dimension) and it seeks to explore any possible relationship between these voids and the undesirable phenomena of 'popcorning' and delamination, the latter associated with solder reflow for electronics packages that have been exposed to humid environments.