首页> 外文期刊>International journal of hydrogen energy >Electrical conduction behaviors and mechanical properties of Cu doping on B-site of (La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1))O_(3-δ) interconnect materials for SOFCs
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Electrical conduction behaviors and mechanical properties of Cu doping on B-site of (La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1))O_(3-δ) interconnect materials for SOFCs

机译:SOFCs的(La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1))O_(3-δ)互连材料的B位掺杂Cu的导电行为和力学性能

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The microstructure, lattice parameters, mechanical properties, and electrical conductivity mechanisms for Cu doping on B-site of (La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1))O_3-δ have been systematically investigated. In this study, the concept of defect chemistry is used to explain the relationship between the concentration of hole with the electrical conductivity. The information of charge compensation mechanisms and defect formation may be valuable for a better understanding of the interconnect of (La_(0.8)Ca_(0.2))CrO_3-δ abased ceramics used for solid oxide fuel cells (SOFCs). The electrical conductivity increases with the increase in temperature in air, whereas the electrical conductivity has a maximum value at a certain temperature in 5% H_2-95% Ar. The concentration of hole at high oxygen activity is larger than that at low oxygen activity. Because (La_(0.8)Ca_(0.2))CrO_3-δ abased ceramics are p-type conductors, the electrical conductivity is dominated by the concentration of hole. Obviously, the electrical conductivities of Cu doping on B-site of (La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1)CrO_3-δ in air are larger than those in 5% H_2-95%. At higher Cu-doping levels, higher temperatures, and high oxygen activity, the compensation mechanism is significantly dominated by the formation of oxygen vacancy, i.e. ionic compensation. On the contrary, the compensation mechanism is significantly dominated by the formation of the formation of Cr~4+, i.e. electrical compensation at lower Cu-doping levels, higher temperatures, and lower oxygen activity. Because mechanical properties of SOFCs interconnect materials are very important in reducing~(-1)tmosphere, the effect of atmospheres on fracture toughness and microhardness for specimens is investigated, which results revealed that when specimens were exposed to 5% H_2-95% Ar forming gas, all specimens appeared to have hydrogen-induced cracking (HIC) except for (La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1))CrO_3-δ . Although the exact mechanism of HIC is still not clear, it is known from this study that Cu doped in the B-site of (La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1))CrO_3-δ enhanced HIC damage and with the increase of Cu-doping level, the degree in HIC is increased.
机译:研究了(La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1))O_3-δB位掺杂Cu的微观结构,晶格参数,力学性能和导电机理。在这项研究中,缺陷化学的概念被用来解释空穴浓度与电导率之间的关系。电荷补偿机制和缺陷形成的信息对于更好地理解用于固体氧化物燃料电池(SOFC)的(La_(0.8)Ca_(0.2))CrO_3-δa基陶瓷的互连可能是有价值的。电导率随空气温度的升高而增加,而电导率在5%H_2-95%Ar的特定温度下具有最大值。高氧活度时的空穴浓度大于低氧活度时的空穴浓度。由于(La_(0.8)Ca_(0.2))CrO_3-δ基陶瓷是p型导体,因此电导率受空穴浓度的支配。显然,空气中(La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1)CrO_3-δ的B位掺杂的Cu的电导率大于5%H_2-95%时的Cu电导率。较高的Cu掺杂水平,较高的温度和较高的氧活度,补偿机理主要由氧空位的形成(即离子补偿)决定;相反,补偿机理主要由Cr〜的形成形成。 4+,即在较低的Cu掺杂水平,较高的温度和较低的氧活度下进行电补偿,因为SOFC互连材料的机械性能在降低〜(-1)气氛方面非常重要,所以气氛对合金的断裂韧性和显微硬度的影响对样品进行了研究,结果表明,当样品暴露于5%H_2-95%Ar形成气体中时,除了(La_(0.8)Ca_(0.2))(Cr_( 0.9)Co_(0.1))CrO_3-δ。虽然是精确的机械HIC的sm仍不清楚,从这项研究中可以看出,Cu掺杂在(La_(0.8)Ca_(0.2))(Cr_(0.9)Co_(0.1))CrO_3-δ的B位中增强了HIC的损伤,随着Cu掺杂水平的提高,HIC的含量也随之增加。

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