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Application of CuS-ZnS PN junction for photoelectrochemical water splitting

机译:CuS-ZnS PN结在光电化学水分解中的应用

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A CuS thin film was prepared by the sulfurization of the electrodeposited copper layer on the FTO substrate using sulfur powder at 400 degrees C. Surface morphology and structure of the CuS thin film were investigated by scanning electron microscopy and X-ray diffraction. The surface morphology of the CuS thin film was worm-like with the diameter of 70 nm and its crystal structure was hexagonal. Band gap energy of the CuS thin film was obtained as 1.5 eV using absorption spectra. Photoelectrochemical response of the CuS thin film was analyzed under chopped illumination at negative and positive potentials. It showed photoelectrochemical response at negative potentials (ca. 2.6 mu A cm(-2) at -0.4 V vs. Ag/AgCl), but not at positive potentials, which confirmed its p-type semiconductivity. A ZnS thin film was synthesized by spray pyrolysis method and characterized using field emission scanning electron microscopy, X-ray diffraction and UV-vis spectrometer. It was shown that the surface morphology was smooth with the grain size of about 50-150 nm. Also, its crystal structure and band gap energy were hexagonal and 3.72 eV, respectively. In order to obtain PN (positive-negative) junction and increase photoelectrochemical response, the ZnS (n-type semiconductor) thin film was deposited on CuS (p-type semiconductor). Linear scan of elemental composition confirmed the presence of FTO, CuS and ZnS layers. Photoelectrochemical characterization showed more photoresponse than the CuS thin film at negative potentials (13.6 A cm(-2) at -0.4 V vs. Ag/AgCl) and no photoresponse at positive potentials. The results confirmed the synthesizing of PN junction at the interface of CuS and ZnS. (C) 2017 Hydrogen Energy Publications LLC. Published by Elsevier Ltd. All rights reserved.
机译:通过在400摄氏度下使用硫粉对FTO基板上的电沉积铜层进行硫化来制备CuS薄膜。通过扫描电子显微镜和X射线衍射研究了CuS薄膜的表面形态和结构。 CuS薄膜的表面形态为直径70nm的蠕虫状,其晶体结构为六方晶。使用吸收光谱获得的CuS薄膜的带隙能量为1.5eV。在负电势和正电势下,在斩光下分析了CuS薄膜的光电化学响应。它在负电位下显示光电化学反应(在-0.4 V对Ag / AgCl时约为2.6μA cm(-2)),但在正电位下没有,这证实了其p型半导电性。通过喷雾热解法合成了ZnS薄膜,并利用场发射扫描电子显微镜,X射线衍射和紫外可见光谱仪对其进行了表征。结果表明,表面形貌光滑,晶粒尺寸约为50-150 nm。另外,其晶体结构和带隙能分别为六方和3.72eV。为了获得PN(正-负)结并增加光电化学响应,将ZnS(n型半导体)薄膜沉积在CuS(p型半导体)上。元素组成的线性扫描证实了FTO,CuS和ZnS层的存在。光电化学表征显示在负电势下比CuS薄膜具有更多的光响应(在-0.4 V对Ag / AgCl时为13.6 A cm(-2)),在正电势下没有光响应。该结果证实了在CuS和ZnS的界面上PN结的合成。 (C)2017氢能出版物有限公司。由Elsevier Ltd.出版。保留所有权利。

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