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首页> 外文期刊>International Journal of Heat and Mass Transfer >Enhanced pool boiling heat transfer mechanisms for selectively sintered open microchannels
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Enhanced pool boiling heat transfer mechanisms for selectively sintered open microchannels

机译:增强的池沸腾换热机制,用于选择性烧结开放微通道

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摘要

Pool boiling performance can be enhanced significantly by generating separate liquid-vapor pathways through selectively coating different regions of a heat transfer surface. In this paper, heat transfer mechanisms are explored by depositing porous coatings on an open microchannel with channel width 762 μm, channel depth 400 μm and fin width 200 μm. Three surfaces were fabricated with sintered porous coatings on: (ⅰ) entire microchannel surface (sintered-throughout), (ⅱ) only the fin tops (sintered-fin-top), and (ⅲ) only the channel walls (sintered-channel). Their pool boiling performance with degassed water at atmospheric pressure was experimentally obtained. A critical heat flux (CHF) of 313 W/cm~2 at a wall superheat of 7.5 ℃ was obtained for a sintered-throughout surface with a 2.4 fold enhancement in CHF over a plain chip. Highest heat transfer coefficient (HTC) of 565 kW/m~2 ℃ was obtained for this surface which translated into a 6.5 fold enhancement when compared to a plain surface. Three enhancement mechanisms were identified: (ⅰ) Area Augmented Enhanced Nucleation, (ⅱ) Bubble Induced Liquid Jet Enhancement - Type-1 and (ⅲ) Bubble Induced Liquid Jet Enhancement - Type-2. These mechanisms were responsible for the enhancement in HTC and CHF for sintered-throughout, sintered-fin-tops and sintered-channels, respectively. Although the current testing indicated the sintered-throughout surface to provide the highest CHF and HTC enhancement for the selected microchannel dimensions, changing the microchannel dimensions is expected to influence the relative merits of these configurations as the liquid and vapor flow mechanisms are influenced in fundamentally different ways.
机译:通过选择性地涂覆传热表面的不同区域产生单独的液体-蒸气通道,可以显着提高池沸腾性能。在本文中,通过在通道宽度为762μm,通道深度为400μm和鳍片宽度为200μm的开放式微通道上沉积多孔涂层来研究传热机理。在烧结的多孔涂层的三个表面上制作:(ⅰ)整个微通道表面(烧结),(ⅱ)仅翅片顶部(烧结翅片顶部)和(ⅲ)仅通道壁(烧结通道) 。通过实验获得了它们在大气压下用脱气水的沸腾性能。烧结后的表面在7.5℃壁过热下的临界热通量(CHF)为313 W / cm〜2,与普通芯片相比,其CHF增强了2.4倍。该表面的最高传热系数(HTC)为565 kW / m〜2℃,与普通表面相比,传热系数提高了6.5倍。确定了三种增强机制:(ⅰ)增强区域形核增强,(ⅱ)气泡诱导的液体射流增强-1型和(ⅲ)气泡诱导的液体射流增强-2型。这些机制分别负责提高HTC和CHF的烧结通量,翅片烧结顶部和烧结通道。尽管当前的测试表明,烧结后的表面可为选定的微通道尺寸提供最高的CHF和HTC增强性能,但改变微通道尺寸预计会影响这些配置的相对优点,因为液体和蒸汽的流动机理会受到根本性的影响方法。

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