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Study of normal spectral emissivity of copper during thermal oxidation at different temperatures and heating times

机译:不同温度和加热时间下热氧化过程中铜的正态光谱发射率研究

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The normal spectral emissivity of oxidized copper is measured by an experimental setup based on a Fourier transform infrared spectrometer (Bruker 70V) in the wavelength range of 3-20 gm at four temperatures (573 K, 673 K, 773 K, 873 K) during thermal oxidation. Normal spectral emissivity of the samples is obtained every ten minutes for 60 min while the samples are heated at each temperature. The influence of wavelength, temperature, and heating time on the normal spectral emissivity of pure copper during the oxidation process is analyzed. It was found that the spectral emissivity at 12 gm, 15 mu m, and 17 gm remained constant for different heating times at 673 K. At the other three temperatures, the normal spectral emissivity demonstrated only a marginal increase with the increase of the heating time at the same wavelength. The oscillation of normal spectral emissivity of pure copper during oxidation was also found. At shorter wavelengths, the theory of radiation interference between the oxide layer and substrate is introduced to explain the spectral emissivity oscillation. In the long wavelength band, the lattice oscillation of the oxide film is used to explain the spectral emissivity oscillation. To better understand these phenomena and the radiative properties of pure copper during thermal oxidation process, the X-ray diffraction, scanning electron microscope and evaluation of surface roughness were performed to describe the compositions and surface micromorphology of the oxide film. (C) 2018 Elsevier Ltd. All rights reserved.
机译:氧化铜的正常光谱发射率是通过基于傅立叶变换红外光谱仪(布鲁克70V)的实验装置在四个温度(573 K,673 K,773 K,873 K)于3-20 gm的波长范围内进行测量的。热氧化。在十分钟内每十分钟获得一次样品的正常光谱发射率,同时在每个温度下加热样品。分析了波长,温度和加热时间对氧化过程中纯铜正常光谱发射率的影响。发现在673 K的不同加热时间下,在12 gm,15μm和17 gm处的光谱发射率保持恒定。在其他三个温度下,正常光谱发射率仅显示出随加热时间的增加而略有增加在相同的波长。还发现了纯铜在氧化过程中的正常光谱发射率的振荡。在较短的波长下,引入了氧化层和衬底之间的辐射干扰理论来解释光谱发射率振荡。在长波段中,氧化膜的晶格振荡用于解释光谱发射率振荡。为了更好地理解这些现象以及纯铜在热氧化过程中的辐射特性,进行了X射线衍射,扫描电子显微镜和表面粗糙度评估,以描述氧化膜的组成和表面微观形貌。 (C)2018 Elsevier Ltd.保留所有权利。

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