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Photoelastic methods to determine K_Ⅰ K_Ⅱ and K_Ⅲ of internal cracks subjected to mixed mode loading

机译:光弹法确定混合模式载荷作用下内部裂纹的K_Ⅰ,K_Ⅱ和K_Ⅲ

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摘要

The ever increasing research of performances and lightness leads engineers and manufactures toward the development of heavily loaded components, subjected to multiaxial fatigue loads, made of materials with improved surface mechanical properties. In these cases it is not rare the development of internal cracks, whose propagation involves mixed-mode conditions; where an accurate prediction of the growth rate and of the crack path requires the knowledge of the stress intensity factors concerning modes Ⅰ, Ⅱ and Ⅲ. In this paper, an original method for the experimental determination of these quantities is described. It is based on the photoelastic technique and allows to obtain internal cracks with regular shape without using any cutting device.
机译:对性能和轻便性的不断增长的研究使工程师和制造商朝着承受多轴疲劳载荷的重载部件的方向发展,这些部件由具有改善的表面机械性能的材料制成。在这些情况下,内部裂纹的发展并不罕见,内部裂纹的传播涉及混合模式条件。要准确预测生长速率和裂纹路径,需要了解有关模式Ⅰ,Ⅱ和Ⅲ的应力强度因子。在本文中,描述了用于实验确定这些量的原始方法。它基于光弹性技术,无需使用任何切割装置即可获得具有规则形状的内部裂缝。

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