Decrease of Thermal Expansion of Ball Screw Used for Precision Positioning Devices by Peltier Module Cooling Based on Feedback Method

摘要

Many methods of cooling precision positioning devices have been proposed and some have actually been applied. This paper proposes a new method by employing Peltier modules based on feedback to cool the stage as well as the bearing. A specially-designed experimental system is established for verification. As a result of a series of experiments, it is found that the total thermal expansion of the ball screw is within 0.5 μm.