Huawei seals second onshore bond

摘要

HUAWEI TECHNOLOGIES has found ample demand in back-to-back visits to the onshore bond market, even as it waits to resolve barriers to trade in some overseas markets. The Chinese technology firm sold Rmb3bn (US$426m) of three-year medium-term notes at 3.49% last week via sole lead underwriter and sole bookrunner China Construction Bank, its second issue in just a couple of weeks. Pricing came in the lower half of initial guidance of 3.3%-3.9%.