机译:焊接在散热器上的COB阵列的热分析
Key Laboratory of Low-Crade Energy Utilization Technologies and Systems of Ministry of Education, Chongqing University, Chongqing 400030, China College of Power Engineering, Chongqing University, Chongqing 400030, China;
Key Laboratory of Low-Crade Energy Utilization Technologies and Systems of Ministry of Education, Chongqing University, Chongqing 400030, China College of Power Engineering, Chongqing University, Chongqing 400030, China;
Key Laboratory of Low-Crade Energy Utilization Technologies and Systems of Ministry of Education, Chongqing University, Chongqing 400030, China College of Power Engineering, Chongqing University, Chongqing 400030, China;
Key Laboratory of Low-Crade Energy Utilization Technologies and Systems of Ministry of Education, Chongqing University, Chongqing 400030, China College of Power Engineering, Chongqing University, Chongqing 400030, China;
High-power LED; Cold-spray; COB; Heat dissipation; FEM;
机译:SnBi焊接对具有Cu散热器的柔性芯片LED封装的热分析
机译:混合迷你通道的流量和热分析和插槽射流阵列散热器
机译:热老化后散热器超薄四方扁平无铅无铅Sn-Ag-Cu焊料接头的组织和降解
机译:微电子应用中芯片散热器组件的Sn96.5Ag3.0Cu0.5焊料热界面材料的疲劳寿命分析
机译:带有圆形微通道的散热器的三维热分析。
机译:波峰焊接过程中焊锡温度对引脚通孔的影响:热流体结构相互作用分析
机译:柔性球栅阵列基板上Sn-Ag-Cu-1 wt%纳米TiO 2复合焊料的微观结构,热分析和硬度
机译:美国陆军研究实验室液体燃料热光电源演示器的散热器和芯片载体组件的热流体分析。