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Incorporation of Si in MOCVD GaAs Epilayers from the Trimethylgallium Source

机译:在来自三甲基镓源的MOCVD GaAs外延层中掺入Si

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The incorporation behavior of Si impurity present in trimethylgallium in the form of methylchlo- rosilanes was studied in GaAs epitaxial layers grown form trimethylgallium and arsine sources by metalorganic chemical vapor deposition. The fraction of Si atoms incorporated in the GaAs layer was demonstrated to increase with increasing number of Cl atoms per methylchlorosilane molecule. Silicon tetrachloride exhibited the strongest contaminating effect. The maximum SiCl_4 content of trimethylgallium above which GaAs layers with a residual carrier concentration below 10~14 cm~-3 cannot be prepared was estimated as 5 × 10-8 mol/100.
机译:通过金属有机化学气相沉积技术,研究了从三甲基镓和a源生长的GaAs外延层中,以甲基氯硅烷形式存在于三甲基镓中的Si杂质的掺入行为。事实表明,随着每个甲基氯硅烷分子中Cl原子数的增加,掺入GaAs层中的Si原子分数会增加。四氯化硅显示出最强的污染效果。三甲基镓的最大SiCl_4含量估计为5×10-8 mol / 100,高于该含量不能制备残留载流子浓度低于10〜14 cm〜-3的GaAs层。

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