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Acoustic Phenomena in Damaged Ceramic Capacitors

机译:损坏的陶瓷电容器中的声学现象

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摘要

Multilayer ceramic capacitors are prone to mechanical defects and damage because of the fragility of the ceramic dielectric. Because these faults are often not recognized by visual or electrical inspection, a nondestructive fast way of detecting these defects would be very useful. Ceramic capacitors are known to generate acoustic emissions, caused by mechanical vibration of the capacitor body. Physical defects alter the mechanical properties of the capacitor, which, in turn, affect the acoustic signature of the capacitor. In this paper, acoustic information is acquired directly from both pristine and damaged capacitors. An experiment was conducted where capacitors were driven with a voltage chirp over a wide range of frequencies, and subsequent acoustic emissions were measured with a piezoelectric point contact sensor. Test boards were bent to cause flex cracks to the soldered capacitors, which were measured acoustically before and after bending. A comparison of these measurements showed that printed circuit board bending causes characteristic changes to the capacitor acoustic response, which can be correlated with the resulted damage.
机译:由于陶瓷电介质的易碎性,多层陶瓷电容器易于产生机械缺陷和损坏。由于这些故障通常无法通过视觉或电气检查来识别,因此检测这些缺陷的非破坏性快速方法将非常有用。已知陶瓷电容器会由于电容器主体的机械振动而产生声发射。物理缺陷会改变电容器的机械性能,进而影响电容器的声学特征。在本文中,直接从原始电容器和损坏的电容器中获取声学信息。进行了一个实验,其中电容器在很宽的频率范围内由电压线性调频脉冲驱动,随后使用压电点接触传感器测量了声发射。弯曲测试板,使焊接电容器产生挠曲裂纹,在弯曲之前和之后进行声学测量。这些测量结果的比较表明,印刷电路板弯曲会导致电容器声学响应的特性变化,这可能与造成的损坏相关。

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