Resistivity and adhesive strength of thin film metallizations onsingle crystal quartz

摘要

Resistivity and adhesive strength were measured for the thin filmsn450 Å Cr-1800 Å Au, 450 Å Cr-1000 Å Mo-1800nÅ Au, 450 Å Cr-1000 Å Ni-1800 Å Au, 450 ÅnMo-1800 Å Au, 1800 Å Au, and 2000 Å Al on z-andnAT-oriented single crystal quartz substrates in the as-depositedncondition as well as after thermal annealing at 380°C and 450°Cnfor 30 min in air or vacuum. The Cr-Au films exhibited significantnresistivity increases after thermal annealing which were caused by theninterdiffusion of Cr and Au. Barrier layers of Mo or Ni limited suchnincreases after heat treatment. The Mo-Au, Au, and Al films exhibitednresistivity decreases following thermal annealing. The mean adhesivenstrengths of the Cr-Au, Cr-Mo-Au, and Cr-Ni-Au films were excellent innthe as-deposited and annealed conditions, ranging from 41 MPa to 70 MPa.nThe Mo-Au and Au films maintained relatively poor adhesion under allncircumstances. Heat treatment improved the poor adhesive strength of thenas-deposited Al films to values exceeding 63 MPa. Resistivity andnadhesive strengths did not differ significantly between the z- andnAT-oriented substrates