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Volumetric limits of planar integrated resonant transformers: a 1 MHz case study

机译:平面集成谐振变压器的体积极限:1 MHz案例研究

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摘要

The integrated planar resonant/transformer structures analyzed are constructed from planar ferrites, conductive layers, leakage layers and ceramic dielectric substrates. The minimum dimensions for these electromagnetically integrated structures are determined based on electromagnetic and technological limits respectively. Thus to answer the question as to what is the minimum required volume that can be theoretically achieved, the electromagnetic material limits are analyzed. These material limits are expressed in terms of the permeabilities, permittivities and conductivities, skin effect and breakdown field of the different materials. A design based solely on these electromagnetic limits is developed and compared to the present constructional limitations. This is conducted for an example of a particular integrated resonant/transformer structure, the L-L-C-T, to illustrate the analysis. This analysis indicates that design based on the electromagnetic limits results in volumes two orders of magnitude smaller than the present prototypes, illustrating that the power density is at present only limited by constructional technology. The thermal limit, however, is expected to be the next barrier within one order of magnitude.
机译:分析的集成平面谐振/变压器结构由平面铁氧体,导电层,泄漏层和陶瓷介电基片构成。这些电磁集成结构的最小尺寸分别基于电磁和技术极限确定。因此,为了回答关于理论上可以达到的最小所需体积是多少的问题,分析了电磁材料极限。这些材料极限以不同材料的渗透率,介电常数和电导率,集肤效应和击穿场表示。开发了仅基于这些电磁极限的设计,并将其与当前的结构极限进行了比较。这是针对特定集成谐振/变压器结构L-L-C-T的示例进行的,以说明分析。该分析表明,基于电磁极限的设计所产生的体积比当前的原型要小两个数量级,这说明功率密度目前仅受构造技术的限制。但是,热极限有望成为一个数量级内的下一个障碍。

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