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The digital front-end electronics for the space-borne INTEGRAL-SPI experiment: ASIC design, design for test strategies and self-test facilities

机译:用于星空INTEGRAL-SPI实验的数字前端电子设备:ASIC设计,测试策略和自测设备设计

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摘要

The flight model of the digital front-end electronics (DFEE) of the gamma-ray spectrometer SPI has been recently integrated on the INTEGRAL satellite spacecraft. The processing core of the DFEE is based on a dedicated application specific integrated circuit (ASIC). We report on the unified design and test methodology that was deployed to cover the entire life cycle of this subsystem, from initial design simulation to operational self-test and diagnosis operations after launch. Strong emphasis is put on the ASIC design-for-test strategies, from very-high speed integrated circuit description language IEEE 1076 (VHDL) simulation and test bench validation to full scan fabrication test coverage and inflight self-test capability.
机译:伽马射线光谱仪SPI的数字前端电子设备(DFEE)的飞行模型最近已集成到INTEGRAL卫星航天器上。 DFEE的处理核心基于专用的专用集成电路(ASIC)。我们报告了统一的设计和测试方法,该方法已部署到涵盖该子系统的整个生命周期,从初始设计仿真到启动后的操作自测和诊断操作。从超高速集成电路描述语言IEEE 1076(VHDL)仿真和测试台验证到全面扫描制造测试覆盖范围和飞行中自测功能,重点都放在ASIC测试设计策略上。

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