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Elimination of Enhanced Low-Dose-Rate Sensitivity in Linear Bipolar Devices Using Silicon-Carbide Passivation

机译:使用碳化硅钝化消除线性双极型器件中增强的低剂量率灵敏度

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摘要

The type of final chip passivation layer used to fabricate linear bipolar circuits can have a major impact on the total dose hardness of some circuits. It is demonstrated that National Semiconductor Corporation linear bipolar devices fabricated with only an amorphous silicon carbide passivation layer do not exhibit enhanced low-dose-rate sensitivity (ELDRS), while devices from the same production lot fabricated with other types of passivation layers are ELDRS sensitive. SiC passivation possesses mechanical, electrical and chemical properties that make it compatible with linear device fabrication processes. These properties of SiC passivation layers, combined with the excellent radiation response of devices passivated with SiC, make SiC passivation layers a very attractive choice for devices packaged in either ceramic or plastic-encapsulated packages for use in space environments.
机译:用于制造线性双极电路的最终芯片钝化层的类型可能会对某些电路的总剂量硬度产生重大影响。已证明,仅使用非晶碳化硅钝化层制造的美国国家半导体公司线性双极器件不会表现出增强的低剂量率敏感性(ELDRS),而使用其他类型的钝化层制造的同一生产批次的器件对ELDRS敏感。 SiC钝化具有机械,电气和化学性质,使其与线性器件制造工艺兼容。 SiC钝化层的这些特性,再加上被SiC钝化的器件的出色辐射响应,使得SiC钝化层对于以陶瓷或塑料封装的封装形式包装的设备而言,是非常有吸引力的选择。

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