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首页> 外文期刊>Nuclear Science, IEEE Transactions on >Beam Test Measurements With Planar and 3D Silicon Strip Detectors Irradiated to sLHC Fluences
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Beam Test Measurements With Planar and 3D Silicon Strip Detectors Irradiated to sLHC Fluences

机译:使用sLHC通量辐照的平面和3D硅条检测器进行光束测试

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摘要

The planned luminosity upgrade of the CERN LHC to the super LHC (sLHC) requires investigation of new radiation hard tracking detectors. Compared to the LHC, tracking detectors must withstand a 5–10 times higher radiation fluence. Promising radiation hard options are planar silicon detectors with n-side readout and silicon detectors in 3D technology, where columnar electrodes are etched into the silicon substrate. This article presents beam test measurements performed with planar and 3D n-in-p silicon strip detectors. The detectors were irradiated to different fluences, where the maximum fluence was $3times 10^{15}$ 1 MeV neutron equivalent particles per square centimeter $({rm n}_{rm eq}/{rm cm}^{2})$ for the planar detectors and ${2times 10^{15}~{rm n}_{rm eq}/{rm cm}^{2}}$ for the 3D detectors. In addition to signal measurements, charge sharing and resolution of both detector technologies are compared. An increased signal from the irradiated 3D detectors at high bias voltages compared to the signal from the unirradiated detector indicates that charge multiplication effects occur in the 3D detectors. At a bias voltage of 260 V, the 3D detector irradiated to ${2times 10^{15}~{rm n}_{rm eq}/{rm cm}^{2}}$ yields a signal almost twice as high as the signal of the unirradiated detector. Only 30% of the signal of an unirradiated detector could be measured with the planar detector irradiated to ${3times 10^{15}~{rm n}_{rm eq}/{rm cm}^{2}}$ at a bias voltage of 600 V, which was the highest bias voltage applied to this sensor.
机译:计划将CERN LHC升级到超级LHC(sLHC)的光度需要研究新的辐射硬跟踪探测器。与LHC相比,跟踪探测器必须承受5至10倍的辐射通量。具有n侧读数的平面硅探测器和3D技术中的硅探测器是有希望的辐射硬选择,其中柱状电极被蚀刻到硅基板中。本文介绍了使用平面和3D n-p硅条检测器进行的光束测试测量。探测器受到不同的注量辐照,其中最大注量为<公式式= inline“> $ 3×10 ^ {15} $ 1 MeV中子当量粒子每平方厘米 $({rm n} _ {rm eq} / {rm cm} ^ {2})$ 平面检测器和 $ {2×10 ^ {15}〜{rm n} _ {rm eq} / {rm cm} ^ {2}} $ < / tex> 用于3D检测器。除了信号测量之外,还比较了两种检测器技术的电荷共享和分辨率。与来自未辐射检测器的信号相比,处于高偏置电压的来自辐射3D检测器的信号增加表示在3D检测器中发生了电荷倍增效应。在260 V的偏置电压下,将3D检测器辐照到 $ {2×10 ^ {15}〜{rm n} _ {rm eq} / {rm cm} ^ {2}} $ 产生的信号几乎是未辐照检测器信号的两倍。平面检测器辐照 $ {3乘以10 ^ {15}〜{rm n} _ { rmeqeq / {rm cm} ^ {2}} $ 在600 V的偏置电压下,这是施加到此传感器的最高偏置电压。

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