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Design and Architectural Assessment of 3-D Resistive Memory Technologies in FPGAs

机译:FPGA中的3D电阻存储技术的设计和架构评估

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Emerging nonvolatile memories (eNVMs) such as phase-change random access memories (PCRAMs) or oxide-based resistive random access memories (OxRRAMs) are promising candidates to replace Flash and Static Random Access Memories in many applications. This paper introduces a novel set of building blocks for field-programmable gate arrays (FPGAs) using eNVMs. We propose an eNVM-based configuration point, a look-up table structure with reduced programming complexity and a high-performance switchbox arrangement. We show that these blocks yield an improvement in area and write time of up to 3× and 33×, respectively, versus a regular Flash implementation. By integrating the designed blocks in an FPGA, we demonstrate an area and delay reduction of up to 28% and 34%, respectively, on a set of benchmark circuits. These reductions are due to the eNVM 3-D integration and to their low on-resistance state value. Finally, we survey many flavors of the technologies and we show that the best results in terms of area and delay are obtained with Pt/TiO$_{2}$/Pt stack, while the lowest leakage power is achieved by InGeTe stack.
机译:相变随机存取存储器(PCRAM)或基于氧化物的电阻式随机存取存储器(OxRRAM)等新兴的非易失性存储器(eNVM)在许多应用中有望替代闪存和静态随机存取存储器。本文介绍了一组使用eNVM的现场可编程门阵列(FPGA)的新颖构建模块。我们提出了一个基于eNVM的配置点,一个具有降低编程复杂性的查找表结构以及一个高性能的配电箱布置。我们证明,与常规的Flash实现相比,这些块分别将面积和写入时间分别提高了3倍和33倍。通过将设计的模块集成到FPGA中,我们在一组基准电路上分别展示了分别减少多达28%和34%的面积和延迟。这些减少归因于eNVM 3-D集成以及其低导通状态值。最后,我们对多种技术进行了调查,结果表明,使用Pt / TiO $ _ {2} $ / Pt叠层可获得面积和延迟方面的最佳结果,而使用InGeTe叠层可获得最低的泄漏功率。

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