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首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >The current distribution and AC resistance of a microstrip structure
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The current distribution and AC resistance of a microstrip structure

机译:微带结构的电流分布和交流电阻

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The AC resistance of the strip in a microstrip structure is compared with that of an isolated strip for better understanding of the conductor loss mechanism. An analysis is presented of the AC resistance in a microstrip structure for any metallization thickness by deriving the current distribution over the strip cross section. The analysis uses the separation of variables technique and the Green's function method. It shows that the skin current of the strip is concentrated toward the ground plane in a microstrip structure. In the extreme case, the AC resistance of the strip can be twice as high as the AC resistance of the same isolated strip. The imperfect ground plane also adds to the total conductor loss of a microstrip line. For a wide strip over a lossy ground plane at high frequency, the ground plane surface current distribution is concentrated directly under the strip, and the ground plane AC resistance can be as large as the strip AC resistance. Therefore, the total AC resistance at the microstrip line can be four times as high as that of an isolated strip conductor.
机译:将微带结构中的条带的AC电阻与隔离条的AC电阻进行比较,以更好地了解导体损耗机理。通过得出带材横截面上的电流分布,对微带结构中任何金属化厚度的交流电阻进行了分析。分析使用变量分离技术和格林函数方法。它表明带材的趋肤电流在微带结构中集中向接地平面。在极端情况下,条带的交流电阻可能是同一隔离条带的交流电阻的两倍。不完善的接地平面还会增加微带线的总导体损耗。对于在高频下有损接地平面上的宽条带,接地平面的表面电流分布直接集中在条带下方,并且接地层的交流电阻可能与条带的交流电阻一样大。因此,微带线上的总交流电阻可以是隔离带状导体的四倍。

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