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首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >A Wiener-Hopf-type analysis of microstrips printed on uniaxial substrates: effects of the substrate thickness
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A Wiener-Hopf-type analysis of microstrips printed on uniaxial substrates: effects of the substrate thickness

机译:单轴基板上微带的Wiener-Hopf型分析:基板厚度的影响

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摘要

A Wiener-Hopf-type analysis of the canonical problem of a TEM wave obliquely incident at the edge of the truncated upper conductor of a parallel plate waveguide loaded with a uniaxial anisotropic dielectric is presented. A numerical integration scheme as well as a thin substrate approximation for the reflection coefficient is given. The influence of the dielectric anisotropy and the slab thickness on the reflection coefficient and the edge admittance are investigated. Numerical results show the importance of the dielectric anisotropy and the expected effects in microstrip applications.
机译:给出了倾斜入射在装有单轴各向异性电介质的平行板波导的截顶的上导体的边缘倾斜的TEM波的典型问题的Wiener-Hopf型分析。给出了数值积分方案以及反射系数的薄基板近似值。研究了介电常数各向异性和平板厚度对反射系数和边缘导纳的影响。数值结果表明介电各向异性的重要性以及微带应用中的预期效果。

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