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首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >Performance of Inter-Chip RF-Interconnect Using CPW, Capacitive Coupler, and UWB Transceiver
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Performance of Inter-Chip RF-Interconnect Using CPW, Capacitive Coupler, and UWB Transceiver

机译:使用CPW,电容耦合器和UWB收发器的芯片间RF互连性能

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摘要

A novel inter-chip RF-interconnect system operating in the range of 22-29 GHz is described and analyzed in terms of system bit error rate (BER) performance. After characterizing the interconnect channel, plotting the transmitted and received ultrawideband pulses, and estimating the switching noise power density by proposing a novel switching noise attack model, we finally get the results of the system performance. It is shown that the performance degrades with the interconnect distance and the switching noise attacker number. It is concluded that a high data rate at 3.33 Gb/s with a low BER < 10~(-5) over the entire chip of size 30 X 30 mm~(2) is achievable with the radiated power density less than -41 dBm/MHz (or the average transmitted power less than -2.85 dBm).
机译:描述并分析了系统误码率(BER)性能方面工作在22-29 GHz范围内的新型芯片间RF互连系统。通过描述互连通道的特性,绘制发送和接收的超宽带脉冲并通过提出一种新颖的开关噪声攻击模型来估计开关噪声功率密度,我们最终获得了系统性能的结果。结果表明,性能随着互连距离和开关噪声攻击者数量的增加而降低。结论是,在辐射功率密度小于-41 dBm的情况下,可以在尺寸为30 X 30 mm〜(2)的整个芯片上以3.33 Gb / s的速率获得较高的数据速率,而BER <10〜(-5)较低。 / MHz(或平均发射功率小于-2.85 dBm)。

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