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A V-Band Front-End With 3-D Integrated Cavity Filters/Duplexers and Antenna in LTCC Technologies

机译:LTCC技术中具有3D集成腔滤波器/双工器和天线的V波段前端

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摘要

This paper presents a compact system-on-package-based front-end solution for 60-GHz-band wireless communication/sensor applications that consists of fully integrated three-dimensional (3-D) cavity filters/duplexers and antenna. The presented concept is applied to the design, fabrication, and testing of V-band (receiver (Rx): 59-61.5 GHz, transmitter (Tx): 61.5-64 GHz) transceiver front-end module using multilayer low-temperature co-fired ceramic technology. Vertically stacked 3-D low-loss cavity bandpass filters are developed for Rx and Tx channels to realize a fully integrated compact duplexer. Each filter exhibits excellent performance (Rx: IL < 2.37 dB, 3-dB bandwidth (BW) approx 3.5percent, Tx: IL < 2.39 dB, 3-dB BW approx 3.33percent). The fabrication tolerances contributing to the resonant frequency experimental downshift were investigated and taken into account in the simulations of the rest devices. The developed cavity filters are utilized to realize the compact duplexers by using microstrip T-junctions. This integrated duplexer shows Rx/Tx BW of 4.20percent and 2.66percent and insertion loss of 2.22 and 2.48 dB, respectively. The different experimental results of the duplexer compared to the individual filters above are attributed to the fabrication tolerance, especially on microstrip T-junctions. The measured channel-to-channel isolation is better than 35.2 dB across the Rx band (56-58.4 GHz) and better than 38.4 dB across the Tx band (59.3-60.9 GHz). The reported fully integrated Rx and Tx filters and the dual-polarized cross-shaped patch antenna functions demonstrate a novel 3-D deployment of embedded components equipped with an air cavity on the top. The excellent overall performance of the full integrated module is verified through the 10-dB BW of 2.4 GHz (approx4.18percent) at 57.45 and 2.3 GHz (approx3.84percent) at 59.85 GHz and the measured isolation better than 49 dB across the Rx band and better than 51.9 dB across the Tx band.
机译:本文提出了一种用于60 GHz频段无线通信/传感器应用的紧凑的基于系统级封装的前端解决方案,该解决方案由完全集成的三维(3-D)腔滤波器/双工器和天线组成。提出的概念适用于使用多层低温共模技术的V波段(接收机(Rx):59-61.5 GHz,发射机(Tx):61.5-64 GHz)收发器前端模块的设计,制造和测试。烧制陶瓷技术。针对Rx和Tx通道开发了垂直堆叠的3D低损耗腔带通滤波器,以实现完全集成的紧凑型双工器。每个滤波器都具有出色的性能(Rx:IL <2.37 dB,3-dB带宽(BW)约3.5%,Tx:IL <2.39 dB,3-dB BW约3.33%)。研究了有助于谐振频率实验降档的制造公差,并在其余器件的仿真中将其考虑在内。所开发的腔体滤波器用于通过使用微带T型结实现紧凑的双工器。该集成双工器的Rx / Tx BW分别为4.20%和2.66%,插入损耗分别为2.22和2.48 dB。与上面的单个滤波器相比,双工器的不同实验结果归因于制造公差,尤其是在微带T型结上。在Rx频段(56-58.4 GHz)上测得的通道间隔离度优于35.2 dB,在Tx频段(59.3-60.9 GHz)上优于38.4 dB。已报道的完全集成的Rx和Tx滤波器以及双极化十字形贴片天线功能证明了嵌入式组件的新型3-D部署,其顶部装有气孔。通过在57.45 GHz时的2.4 GHz(约4.18%)和10.85 GHz在2.3 GHz(约3.84%)的10 dB BW以及在Rx频段上测得的隔离度优于49 dB,验证了全集成模块的出色整体性能并且在Tx频段上优于51.9 dB。

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