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首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >A High-Power CMOS Switch Using A Novel Adaptive Voltage Swing Distribution Method in Multistack FETs
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A High-Power CMOS Switch Using A Novel Adaptive Voltage Swing Distribution Method in Multistack FETs

机译:采用新型自适应电压摆幅分配方法的多堆叠FET大功率CMOS开关

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A high-power CMOS switch using a novel adaptive voltage swing distribution method in a multistack field-effect transistor (FET) scheme is proposed. The proposed adaptive voltage swing distribution method in multistack FETs is very effective in preventing unwanted channel formation with low control voltage supply in off-state FETs. This, in turn, increases power-handling capability when a large-signal voltage swing is applied. In the proposed CMOS switch, the behavior of the voltage swing in off-state multistack FETs shows a difference with respect to the level of input voltage swing. The characteristics of voltage swing distribution and leakage channel formation in the CMOS switch is fully analyzed with incorporation of the novel adaptive voltage swing distribution method into a three-stacked nMOS Rx switch in a standard 0.18-$mu{hbox {m}}$ triple-well CMOS process. In addition, linearity of the proposed technique is verified through the measurement data of the single-pole double-throw switches that employ the proposed technique in the Rx switch. Two different types of configurations are implemented and characterized at the Rx switches, which consist of four-stacked nMOS devices, to demonstrate the method of minimizing voltage stress issues on one of the multistacked FETs. Layout consideration was also taken to prevent interference between leakage signals at the substrate. The measured performance of the proposed design shows an input 0.3-dB compression point of 33.5 dBm at 1.9 GHz. To the best of our knowledge, this is the highest power-handling capability of a CMOS switch in a standard CMOS process ever reported. The insertion losses of the Tx and Rx switches are 1.6 and 1.9 dB, respectively, at 1.9 GHz. The isolation of the Tx and Rx swit-ches is around 20 and 30 dB, respectively, at 1.9 GHz.
机译:提出了一种采用新颖的自适应电压摆幅分配方法的多堆叠场效应晶体管(FET)方案中的大功率CMOS开关。在多堆叠FET中提出的自适应电压摆幅分配方法非常有效,可以通过关断状态FET中的低控制电压电源来防止不必要的沟道形成。当施加大信号电压摆幅时,这反过来又增加了功率处理能力。在提出的CMOS开关中,关态多堆叠FET中电压摆幅的行为相对于输入电压摆幅的水平显示出差异。通过将新颖的自适应电压摆幅分配方法并入标准0.18- $ mu {hbox {m}} $三元组的三层nMOS Rx开关中,对CMOS开关中的电压摆幅分布和泄漏通道形成的特性进行了全面分析。阱CMOS工艺。此外,通过在Rx开关中采用所建议技术的单刀双掷开关的测量数据来验证所建议技术的线性。在Rx开关上实现了两种不同类型的配置并对其进行了表征,该开关由四个堆叠的nMOS器件组成,以展示将多个堆叠FET之一上的电压应力问题最小化的方法。还考虑了布局,以防止基板处的泄漏信号之间的干扰。拟议设计的测量性能表明,在1.9 GHz频率下,输入0.3dB压缩点为33.5 dBm。据我们所知,这是有史以来报告的标准CMOS工艺中CMOS开关最高的功率处理能力。在1.9 GHz时,Tx和Rx开关的插入损耗分别为1.6和1.9 dB。在1.9 GHz时,Tx和Rx开关的隔离度分别约为20和30 dB。

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