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Toward a Sub-Decibel Noise Figure Broadband Monolithic LNA in Silicon

机译:迈向硅分贝噪声系数宽带单片LNA

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This paper reports a first attempt toward realization of a single-chip silicon-based broadband (BW-3dB > 5 GHz) low-noise amplifier (LNA) with a noise figure (NF) of less than 1 dB across the band. A differential common-emitter amplifier with active feedback and neutralization capacitance is adopted without using passives at the input that consume chip area and deteriorate NF due to their loss. Design tradeoffs for NF, gain, and bandwidth versus device size, bias current, and process corners are discussed in detail. The circuit was implemented in a 0.13-mum SiGe BiCMOS process with fT = 200 GHz and fmax = 244 GHz for an HBT with emitter length of 6 mum and bias current of 7.6 mA. The differential probed measurement of the LNA shows a gain of 27.5 dB with -3-dB bandwidth from 0.5 to 5.5 GHz. The NF varies from 1.35 to 1.85 dB within the band. The chip is also packaged in a high-frequency package with subminiature A connectors for inputs and outputs. The single-ended packaged measurement of the LNA shows a gain of 25.2 dB with -3-dB bandwidth from 0.5 to 6.0 GHz. The NF varies from 1.2 to 1.7 dB within the band. The chip draws 24 mA from a 2-V supply and occupies 0.88 mm times 0.83 mm.
机译:本文报道了实现单芯片基于硅的宽带(BW-3dB> 5 GHz)低噪声放大器(LNA)且在整个频带内噪声系数(NF)小于1 dB的首次尝试。采用具有有源反馈和中和电容的差分共发射极放大器,而无需在输入端使用无源器件,这会浪费芯片面积并由于损耗而使NF恶化。详细讨论了NF,增益和带宽与器件尺寸,偏置电流和工艺角的设计折衷。该电路采用0.13微米SiGe BiCMOS工艺实现,对于发射极长度为6微米,偏置电流为7.6 mA的HBT,fT = 200 GHz,fmax = 244 GHz。 LNA的差分探测测量显示,增益为27.5 dB,带宽为0.5至5.5 GHz时为-3-dB。频带内的NF在1.35至1.85 dB之间变化。该芯片还封装在高频封装中,带有用于输入和输出的超小型A连接器。 LNA的单端封装测量结果显示,在0.5至6.0 GHz的-3-dB带宽下,增益为25.2 dB。频带内的NF在1.2至1.7 dB之间变化。该芯片从2 V电源汲取24 mA电流,占地0.88毫米乘以0.83毫米。

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