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A Broadband and Vialess Vertical Microstrip-to-Microstrip Transition

机译:宽带和无孔垂直微带到微带的过渡

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摘要

A novel, broadband, vialess, and vertical microstrip-to-microstrip transition is proposed in this paper. The transition consists of two open-circuited microstrip resonators and a U-shaped resonant-slot on the common ground plane. A physics-based equivalent-circuit model is developed for interpreting its working mechanism and facilitating the design process. The transition is analogous to a three-pole resonator filter. Based on the equivalent-circuit model, the coupling coefficients of the physical circuit can be calculated from the group delay information of two segregated electromagnetic models. To effectively control the couplings, a modified configuration is also proposed. A prototype transition is designed using the proposed design formulas. The fabricated circuit is measured to validate the proposed transition and the equivalent-circuit model. Good agreement is obtained between not only the measured and the simulated performance, but also the designed and the extracted-circuit model. In addition to the wide bandwidth, the features of vialess and easy fabrication make the novel transition very attractive for system-on-package applications.
机译:本文提出了一种新颖的,宽带的,无孔的,垂直的微带到微带过渡。过渡部分包括两个开路微带谐振器和一个位于公共接地面上的U形谐振槽。开发了基于物理的等效电路模型,以解释其工作机制并简化设计过程。该过渡类似于三极谐振器滤波器。基于等效电路模型,可以从两个分离的电磁模型的群时延信息计算出物理电路的耦合系数。为了有效地控制联轴器,还提出了修改的配置。使用建议的设计公式设计原型过渡。测量所制造的电路以验证所提出的过渡和等效电路模型。不仅在测量性能和仿真性能之间,而且在设计电路和提取电路模型之间都取得了良好的一致性。除宽带宽外,无孔且易于制造的特性使这种新型过渡对系统级封装应用非常有吸引力。

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