Numerical Investigation of Magnetic Resonant Coupling Technique in Inter-Chip Communication via Electromagnetics-TCAD Coupled Simulation

摘要

Wireless power transfer based on magnetic resonant coupling (MRC) has attracted extensive studies for its applications in macroscopic engineering. In this work, we explore one potential application of MRC in microelectronics, i.e., as an enhancement of inductive coupling for wireless inter-chip communication. Theoretical analysis and numerical simulation are conducted to study the advantages of MRC in power transfer efficiency. In particular, a new EM-semiconductor simulator is employed to provide a faithful description for the interactions between magnetic fields and semiconductor carrier transport.