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Test results for a subscale (100 kA) SMES splice

机译:次级量表(100 kA)SMES接头的测试结果

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The design for the 20 MW-hr SMES-ETM for the Bechtel concept calls for two splices per turn of conductor, and over 100 turns. The design value of resistance for the splices is on the order of 10/sup -11/ ohms (0.4) W/splice at 200 kA), which is an order of magnitude less than the state of the art for high current devices. The splice design utilizes a superconducting braid wrapped around lapped subcables for an extremely low resistance joint. A history of the manufacturing development for the splice is presented. The performance of a sub-scale version of the splice joint has been measured at Texas Accelerator Center. Values of splice resistance at 1.8 K and background fields up to 5 T are reported. Performance of a 100 kA conductor is also reported.
机译:用于Bechtel概念的20 MW-hr SMES-ETM的设计要求导体每转一圈要连接两个接头,并且导线匝数必须超过100圈。接头的电阻设计值在200 kA时约为10 / sup -11 /欧姆(0.4)W /接头,约为大电流设备的现有技术水平的一个数量级。接头设计利用包裹在重叠的子电缆周围的超导编织层来实现极低的电阻连接。介绍了接头的制造发展历史。德克萨斯州加速器中心已测量了拼接接头的小尺寸版本的性能。据报道,在1.8 K和最高5 T的背景场的抗熔接值。还报告了100 kA导体的性能。

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