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首页> 外文期刊>IEEE Transactions on Geoscience and Remote Sensing >Thin Dielectric Sheet-Based Surface Integral Equation for the Scattering Simulation of Fractures in a Layered Medium
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Thin Dielectric Sheet-Based Surface Integral Equation for the Scattering Simulation of Fractures in a Layered Medium

机译:基于薄介质片的表面积分方程,用于层状介质中断裂的散射模拟

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摘要

Electromagnetic simulation of fractures has a growing importance in geophysical exploration, where the formation is usually inhomogeneous and modeled as a layered medium (LM). In this paper, we have developed the first integral-equation based solver to simulate the scattering of fractures straddling an LM. We refer to this solver as LM-thin dielectric sheet (TDS)-surface integral equation (SIE), since it is built on the TDS-based SIE and the LM Green's function (LMGF). Compared with the traditional finite element method (FEM) and volume integral equation (VIE), LM-TDS-SIE achieves excellent efficiency by taking advantage of the multiscale feature of fracture, rather than being restricted by its volumetric mesh. Good accuracy but the lower computational cost of LM-TDS-SIE is well demonstrated by investigating several typical examples, where reference results are obtained by the commercial software COMSOL. In addition to fractures, LM-TDS-SIE can also be used to simulate the scattering from other types of TDS.
机译:裂缝的电磁模拟在地球物理勘探中具有越来越重要的意义,在该勘探中,地层通常是不均匀的,并被建模为层状介质(LM)。在本文中,我们开发了第一个基于积分方程的求解器,以模拟横跨LM的裂缝的散射。我们将此求解器称为LM薄介电片(TDS)-表面积分方程(SIE),因为它是基于TDS的SIE和LM Green函数(LMGF)建立的。与传统的有限元方法(FEM)和体积积分方程(VIE)相比,LM-TDS-SIE通过利用裂缝的多尺度特征获得了出色的效率,而不受其体积网格的限制。通过研究几个典型示例可以很好地证明LM-TDS-SIE的准确性,但较低的计算成本,其中商用软件COMSOL获得了参考结果。除裂缝外,LM-TDS-SIE还可以用于模拟其他类型TDS的散射。

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