1-to-27 highly parallel three-dimensional intra- and inter-board optical interconnects

摘要

The authors present a novel interconnection scheme for highly parallel three-dimensional (3-D) optical intra- and inter-board fan-out using substrate guided waves in conjunction with a two-dimensional (2-D) multiplexed hologram array. 1-to-27 passive highly parallel optical fan-out was demonstrated for the first time. Optimum design rules are presented together with experimental results. The effort of employing substrate guided waves in conjunction with a 2-D multiplexed holograms array provides the capability of 3-D multi-stage intra- and inter-board massively parallel interconnects. As a result, the coupling from a laser diode to multi-stage two dimensional detector arrays and/or fiber array can thus be realized.