Room-temperature photo-pumped operation of 1.58-/spl mu/m vertical-cavity lasers fabricated on Si substrates using wafer bonding

摘要

Long-wavelength vertical cavity lasers have been successfully fabricated on Si substrates using direct wafer bonding. InGaAs-InGaAsP multiquantum-well active layers with 40.5-pair InGaAsP-InP stacked mirrors have been directly bonded on 3.5-pair Al/sub 2/O/sub 3//a-Si mirrors deposited on Si substrates. The sample has been optically pumped at room temperature and lasing operation at 1.58-/spl mu/m has been achieved.