Packaged photonic probes for an on-wafer broad-band millimeter-wave network analyzer

摘要

We report the fabrication of integrated and packaged active photonic probes that enable on-wafer measurements of electrical scattering parameters with a bandwidth exceeding 300 GHz. The probes use a high-speed uni-traveling-carrier photodiode (UTC-PD) to optically generate the electrical stimulus and the electro-optic sampling (EOS) technique to measure the electrical signals. The modules are packaged using micro-optic technology and exhibit excellent optical characteristics. They are easy to use, enable reliable and reproducible measurements, and should help to overcome the bandwidth-limitation of present all-electronic similar systems.