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High Efficiency InGaN Blue Light-Emitting Diode With ${>}{rm 4}hbox{-}{rm W}$ Output Power at 3 A

机译:在3 A时具有$ {>} {rm 4} hbox {-} {rm W} $输出功率的高效InGaN蓝光发光二极管

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摘要

This letter reports high-power and high-efficiency characteristics of the InGaN-based blue light-emitting diode (LED) operating at ${>}{rm 10}hbox{-}{rm W}$ electrical input power in a single-chip package. The LED chip is fabricated as a vertical-injection structure with chip dimensions of 1.8 mm $times,$1.8 mm. InGaN/GaN short-period superlattice (SL) structures are employed below multiple-quantum-well active region as current spreading layers. It is found, by simulation, that SL layers are quite effective in improving current spreading and uniformity in carrier distribution. When the characteristics of the fabricated LED package are measured under pulsed operation conditions, efficiency droop is found to be greatly reduced in the LED structure with SL layers. A record high light output power of 4.18 W and external quantum efficiency of 51% are demonstrated at 3-A injection current.
机译:这封信报道了InGaN基蓝色发光二极管(LED)的高功率和高效率特性,其单输入功率为$ {>} {rm 10} hbox {-} {rm W} $。芯片封装。 LED芯片被制造为具有1.8mm×1.8mm的芯片尺寸的垂直注入结构。在多量子阱有源区下方采用InGaN / GaN短周期超晶格(SL)结构作为电流扩散层。通过仿真发现,SL层在改善电流扩展和载流子分布均匀性方面非常有效。在脉冲操作条件下测量制成的LED封装的特性时,发现具有SL层的LED结构的效率下降会大大降低。在3A注入电流下,光输出功率达到创纪录的4.18 W,外部量子效率达到51%。

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