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A Microwave Modeling Oxymoron?: Low-Frequency Measurements for Microwave Device Modeling

机译:微波建模Oxymoron ?:微波设备建模的低频测量

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摘要

For a number of decades, the modeling of microwave transistors relied on specific well-known characterization methods. Those methods include S-parameters measurement through vector network analyzers (VNAs) ranging from the lower end of the RF spectrum to the millimeter-wave (mm-wave) region and load pull measurements of transistors used for the design of power amplifiers (PAs). Later, the availability of more powerful computer-aided design (CAD) software enabled the need for models of active microwave devices, thus driving a huge amount of research activity on microwave transistor modeling. Simultaneously, new transistor technologies were invented, combining working concepts such as heterojunction bipolar transistors (HBTs), metal semiconductor field effect transistors (MESFETs) or high electron mobility transistors (HEMTs) and new materials such as gallium arsenide (GaAs), gallium nitride (GaN), indium phosphide (InP), and silicon germanium (SiGe), to cite only the main ones.
机译:数十年来,微波晶体管的建模一直依赖于特定的众所周知的表征方法。这些方法包括通过矢量网络分析仪(VNA)进行S参数测量,范围从RF频谱的下端到毫米波(mm-wave)区域,以及用于功率放大器(PA)设计的晶体管的负载拉力测量。后来,更强大的计算机辅助设计(CAD)软件的出现使人们需要有源微波设备的模型,从而推动了对微波晶体管建模的大量研究活动。同时,发明了新的晶体管技术,结合了工作原理,例如异质结双极晶体管(HBT),金属半导体场效应晶体管(MESFET)或高电子迁移率晶体管(HEMT)和新材料,例如砷化镓(GaAs),氮化镓( GaN,磷化铟(InP)和硅锗(SiGe),仅举主要例子。

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