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Mixed signal test-techniques, applications and demands

机译:混合信号测试技术,应用和需求

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摘要

Increasing importance of next technology to provide high quality,nlow cost fault detection methodologies is becoming a big issue in thenmicroelectronics industry. For digital ASICs, techniques such asnIddq and built-in-self test are being introduced tonsupplement or in some cases replace stuck-at testing that has been shownnto be inadequate for the circuit complexities and quality levelsndemanded. For analogue and mixed signal ICs, a similar trend is evident.nIncreasing circuit complexity, higher performance and the demand fornhigh quality levels is causing the industry to question currently usednfunctional and specification based test programs. In addition, thenescalating costs of production test equipment capable of measuring highnperformance device parameters is in many cases becoming a limitingnfactor. The authors review the current state-of-the art in mixed signalnand analogue test particular reference to the consumer electronicsnindustry. Trends in key issues such as design-for-test, faultnsimulation, defect detection, CAD and tester support are discussed andnthe possible future role of these techniques is proposed for the nextngeneration of single chip analogue and mixed signal test systems
机译:为了提供高质量,低成本的故障检测方法,下一代技术的重要性日益提高,这已成为当时微电子行业的一个大问题。对于数字ASIC,正在引入诸如nIddq和内置自我测试之类的技术,以增加容量,或者在某些情况下替代已被证明不足以解决电路复杂性和质量水平的卡死测试。对于模拟和混合信号IC,明显的趋势是明显的。n电路复杂性的提高,性能的提高以及对高品质水平的需求,引起业界对当前使用的基于功能和规格的测试程序提出质疑。另外,在许多情况下,能够测量高性能设备参数的生产测试设备的升级成本已成为限制因素。作者回顾了混合信号和模拟测试的最新技术,特别是针对消费电子行业的参考。讨论了诸如测试设计,故障仿真,缺陷检测,CAD和测试仪支持等关键问题的趋势,并提出了这些技术在下一代单芯片模拟和混合信号测试系统中的未来作用。

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