RESEARCH AND DEVELOPMENT ON PERFORMANCES OF LARGE-SIZED THERMOELECTRIC MODULE WITH HEAT PIPES

摘要

Experimental development results of a large-size thermoelectric cooling module with heat pipes, which is capable of providing a thermal stabilization of electronic components of heightened power, are presented. The application of such assemblies of large-size modules and flat heat pipes allows us to meet the challenges of heat removal under increased heat flows and space limitedness for conventional heat-removing heat sinks placement. The construction and manufacturing technique of modules are optimized. Parameter analysis and characteristics of modules with heat pipes in different modes and heat removal conditions are performed. It is shown that it is reasonable to reduce heat pipe thermal resistance to the level of 0.05 K/W for the purpose of cooling efficiency increase.