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Thermal and microstructural properties of spark plasma sintered tungsten for the application to plasma facing materials

机译:火花等离子体烧结钨的热和微观结构特性,用于等离子体覆盖材料

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In this study, we investigated thermal and microstructural properties of pure and dispersion strengthened tungsten fabricated by Spark Plasma Sintering (SPS) method in comparison to the tungsten materials produced by different commercial suppliers. We measured the thermal conductivity of the examined materials and compared them with chemical composition, density and microstructure of the samples. Thermal conductivity up to 900 degrees C was derived from thermal diffusivity and specific heat measurement and chemical composition was analyzed through glow discharge mass spectroscopy. Thermal conductivity values show a close correlation with content of compositional element. On the other hand, Vickers hardness shows correlation with the average grain size of the samples. The sample produced by different fabrication process shows different density and thermal conductivity. While TiC and Y2O3 added tungsten fabricated by SPS method shows improved stability in microstructure against recrystallization after exposure to high heat flux, the reduction of thermal conductivity is analyzed in comparison to the amount of contained additive elements.
机译:在这项研究中,我们调查了通过火花等离子体烧结(SPS)方法制造的纯钨和弥散强化钨的热和微观结构特性,与不同商业供应商生产的钨材料相比。我们测量了所检查材料的热导率,并将其与样品的化学成分,密度和微观结构进行了比较。通过热扩散率和比热测量得出高达900摄氏度的导热系数,并通过辉光放电质谱分析化学成分。热导率值显示与组成元素的含量密切相关。另一方面,维氏硬度显示出与样品的平均晶粒尺寸的相关性。通过不同的制造工艺生产的样品显示出不同的密度和热导率。通过SPS法制备的添加了TiC和Y2O3的钨在暴露于高热通量后显示出改善的抗再结晶微观结构稳定性,但与所含添加剂元素的量相比,分析了热导率的降低。

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