首页> 外文期刊>Frequenz >Integrated Circuits and 3D-Packaging for Low-Power 24 GHz Front End
【24h】

Integrated Circuits and 3D-Packaging for Low-Power 24 GHz Front End

机译:低功耗24 GHz前端的集成电路和3D封装

获取原文
获取原文并翻译 | 示例
       

摘要

Design and experimental results for a low-power monolithic 24 GHz front end are described. As basic circuits VCO and mixer are presented. The circuits are realized on GaAs using heterobipolar transistors The VCO reaches 19% efficiency at 4.3 dBm output power and 14,5 mW DC power consumption. The circuits are to be integrated together with a special slot antenna using flip-chip technology. Simulation data on this novel antenna approach demonstrate acceptable gain characteristics around 3 dB, despite of its small size
机译:描述了低功耗单片24 GHz前端的设计和实验结果。作为基本电路,提出了压控振荡器和混频器。电路使用异质双极晶体管在GaAs上实现。VCO在4.3 dBm输出功率和14.5 mW直流功耗下达到19%的效率。使用倒装芯片技术将电路与特殊的缝隙天线集成在一起。这种新型天线方法的仿真数据尽管尺寸很小,但仍可显示约3 dB的可接受增益特性

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号