A comparison of tungsten-quartz-halogen, plasma arc and light-emitting diode light sources for the polymerization of an orthodontic adhesive

摘要

This study investigated whether there were differences between the debond stress and adhesive remnant index (ARI) of an adhesive cured with three different orthodontic light sources. Sixty sound premolar teeth were divided into three groups of 20. A standard pre-adjusted edgewise premolar bracket (Victory Series™) was bonded to each tooth using a light-cured orthodontic adhesive, Transbond XT™. Group 1 (control) specimens were cured with an Ortholux XT™ (tungsten-quartz-halogen bulb) light for 20 seconds, group 2 with an Ortho lite™ (plasma arc) for 6 seconds and group 3 with an Ortholux LED™ light-emitting diode for 10 seconds. The specimens were debonded 24 hours later using a universal mechanical testing machine, operating at a crosshead speed of 0.5 mm minute−1.