Simulating Hot Swap in CompactPCI

摘要

Hot Swapping incurs rapid charging and discharging of capacitive and inductive elements inherent in the CompactPCI connector, card stub, and PCI device I/O. The CompactPCI bus inherently has the speed and bandwidth to make it an ideal platform for telephony and networking. By adapting the CompactPCI bus specification to this environment, manufacturers can take advantage of existing Windows software and Intel (Hillsboro, OR) chips. The new CompactPCI bus specification can result in considerable developmental cost savings, permitting small companies to enter telephony markets.