Wireless memory migrates to single packages

摘要

Today's feature-rich wireless handsets demand more computing power, more functionality, and increased memory capability in ever-smaller form factors. At the same time, consumer expectations for cost, size, weight, and battery life are not changing. As they deal with these issues along with time-to-market deadlines, handset designers face important questions: 1. What level of integration is available for a given design? 2. Are the different components validated and optimized to work together? 3. What level of flexibility and scalability is inherent in the solution I am specifying? The time to ask these questions is early in the design cycle.