A potential breakthrough technology from Nextreme (Research Triangle Park, NC)-a microscale thermal and power-management device manufacturer-integrates cooling and power-generation capabilities into standard copper pillar bump processes used in high- volume electronic packaging. While copper pillar bumps are typically used as a mechanical or electrical interface, this new technology gives them a new spin, addressing heat and power issues in high-end, flip-chipped devices where higher densities, more features, higher speeds, and
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