Tiny TECs expand laser, sensor apps

摘要

With a cold-side area of 0.98 mm~2, the MPC-D303rnSeries microchip thermoelectric coolers (TEC)rnare one of the company's smallest and support arnmaximum AT of more than 60K, expanding the potentialrnfor laser and photonic sensor applications that require a large bandwidth of thermal control. Based on a scalable silicon MEMS platform technology, the new TECs are said to provide 10 times the cooling/heating power densities of standard thermoelectric coolers.