Thermal gap-filler offers low resistance

摘要

The gel-like Sarcon 100GR-FL thermal interface gap filler pad transfers heat with a thermal conductivity of 2.8 W/m-Kand a thermal re-sistance of 0.67℃ in.2/W at 14.5 psi. The 1.0-mm-thick material is reinforced with an integrated nylon mesh layer to prevent distortion and stretching.rnThe easily installed gap filler pad is true to form and flame retardant. Available in sheets up to 300 x 200 mm. (Contact company for pricing and availability.)