Thermal interface suits tight tolerances

摘要

The Sarcon 25GR-T2d, a soft and highly conformable thermal interface medium, is suitable for low and high-volume production applications. The 0.255-mm-thick TIM offers engineers a durable and cost-effective solution for tight tolerance die-cut operations. Used between a heat source such as a semiconductor and a nearby heat sink, the gap filler pad provides a thermal conductivity of 1.5 W/m°K, and a thermal resistance as low as 0.33℃-in.~2/W.