Advanced packaging technology for logic functions has been ahead of demand for the past five years or so. For much of this period, customers seeking smaller packages for their logic gates have been limited to leaded package styles. These packages include industry standards such as the SOT23, SC70, US8, SOIC, TSSOP, and QVSOP, with I/O counts ranging from five to 80 leads. With each product revision, logic vendors have moved to a smaller package, but with only modest size reductions.
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