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机译:基于温度的动态
Dept. of Inf. Eng., Univ. of Padua, Padua, Italy;
III-V semiconductors; MIS devices; buffer layers; electron traps; gallium compounds; power HEMT; semiconductor device testing; wide band gap semiconductors; GaN; GaN-based MIS-HEMT; backgating conditions; buffer leakage; electrons injection; metal-insulator-semiconductor high electron mobility transistors; off-state bias; positive substrate operation; power HEMT; surface traps; temperature-dependent dynamic RsubON/sub; vertical leakage; Charge carrier processes; Gallium nitride; HEMTs; Logic gates; MODFETs; Substrates; Surface treatment; Current collapse; GaN; dynamic $R_{mathrm {mathrm{{scriptstyle ON}}}}$; dynamic RON; transistor; trapping; trapping.;
机译:H
机译:<内联公式ID =“IEQ1”> <替代品>
机译:具有高外部
机译:石墨烯场效应晶体管具有高外形