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Super Single Pulse Charge Pumping Technique for Profiling Interfacial Defects

机译:用于分析界面缺陷的超级单脉冲泵送技术

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摘要

Traditional charge pumping (CP) technique relies on trap-assisted recombination from the source/drain to the body contact to characterize interface trap density ( ${N}_{ext {it}}$ ) of classical bulk MOSFETs. A variant of the technique called single pulse CP (SPCP) allows interface trap characterization even if the bulk contact is absent, as in silicon-on-insulator (SOI) MOSFET. Unfortunately, neither technique is useful for devices with source-body-tied (SBT) and inhomogeneous channel doping profile, as in lateral diffused MOS (LDMOS) power transistors. Here, we propose a generalization of the CP/SPCP techniques, called Super SPCP ( $ext{S}^{{2}}$ PCP), to extract position-resolved localized degradations ( ${Delta {N}}_{ext {it}}$ ) in an SBT LDMOS. Careful TCAD modeling and experimental characterizations demonstrate the effectiveness of the proposed approach. Our analysis provides deep insights into the physics of the SPCP technique, demonstrating that the approach can be used to characterize a variety of transistors with nontraditional doping profiles and contact configurations.
机译:传统电荷泵(CP)技术依赖于从源/排水管到主体接触的陷阱辅助重组,以表征界面陷阱密度(<内联 - 公式XMLNS:MML =“http://www.w3.org/1998/math / mathml“xmlns:xlink =”http://www.w3.org/1999/xlink“> $ {n} _ { text {it}} $ )。即使在绝缘体上的硅 - 在绝缘体(SOI)MOSFET中,也允许界面陷阱表征的技术的变型允许界面陷阱表征。不幸的是,既不是具有源部件(SBT)和不均匀通道掺杂型材的装置有用的,如横向扩散MOS(LDMOS)功率晶体管。在这里,我们提出了CP / SPCP技术的概括,称为Super SPCP(<内联公式XMLNS:MML =“http://www.w3.org/1998/math/mathml”xmlns:/ xlink =“http:/ / www.w3.org/1999/xlink“> $ text {s} ^ {{2}} $ pcp),要提取解析定位的本地化降级(<内联公式XMLNS:MML =“http://www.w3.org/1998/math/mathml”xmlns:xlink =“http://www.w3.org/1999/ XLINK“> $ { DELTA {n}} _ { text {id} $ )中的sbt ldmos。仔细的TCAD建模和实验表征证明了所提出的方法的有效性。我们的分析为SPCP技术的物理提供了深入的见解,表明该方法可用于表征具有非传统掺杂型材和接触配置的各种晶体管。

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