New HyperTransport version opens multicore doors

摘要

HyperTransport, the physical-layer interchip-communications standard whose claim to fame has been its use on Advanced Micro Devices (www.amd.com) CPU chips, has rolled out its most recent revision, Hyper-Transport 3.0. The new spec substantially changes the capabilities of the interface, broadening its applicability and positioning HyperTransport as a foundation technology for the future of board-level multi-processing.