Two Board Level Shielding Technologies: A Comparison

摘要

As a result of the additional wireless capabilities being designed into mobile consumer products like cell phones, PDAs and laptops, there is an increasing need for more compact and cost effective EMI/KF shielding solutions within these devices. Newer technologies such as Wi-Fi, Bluetooth and GPS are being more frequendy combined with die core transmit/receive engines in mobile devices, thereby increasing the complexity and density of the printed circuit boards upon which these technologies reside. Consumer demand has also driven most of these devices toward smaller and lighter packages diat are both more ergonomic and aesthetically appealing. These changes have forced electrical and mechanical designers alike to take a better look at the EMI/RF shielding options available to them when designing die electronics and packaging of mass-manufactured mobile devices.