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Tree-like breakdown phenomena of dielectric window under X-band high power microwave in vacuum

机译:X波段大功率微波在真空下介电窗的树状击穿现象

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摘要

Surface breakdown of dielectric window seriously limits the transmission of high power microwave (HPM), which blocks the development of microwave technology. Under Xband HPM with the power level of 1 GW at 9.4 GHz, dielectric breakdown experiments were conducted with several dielectric window materials including polytetrafluoroethylene (PTFE), low-density polyethylene (LDPE), high-density polyethylene (HDPE) and polymethyl methacrylate (PMMA) in vacuum. The influence of different surface treatments for PTFE with notching and polishing on its breakdown characteristics is also studied. After breakdown, the photographs of damaged dielectric samples are analyzed with macroscopic and microcosmic observations. There are obvious tree-like breakdown phenomena occurred on the upstream face of the dielectric window along the direction of microwave electric field. The damage is significantly affected by the different surface treatments. It is considered that the treelike breakdown channels are closely related to the applied microwave field. Based on in-depth observation on the tree failure inside the transparent PMMA sample, it was found that, the tree developed along the surface and also inside of the material. A physical model is proposed to describe the dielectric window breakdown under HPM. It is suggested that the electric field results in the tree developing along the material surface. Possible reason for the tree invading into the material is analyzed. Moreover, several kinds of possible manners are presented to describe the tree initiation and development inside the dielectric window.
机译:介电窗的表面击穿严重限制了高功率微波(HPM)的传输,这阻碍了微波技术的发展。在9.4 GHz功率水平为1 GW的Xband HPM下,使用几种介电窗材料进行了介电击穿实验,包括聚四氟乙烯(PTFE),低密度聚乙烯(LDPE),高密度聚乙烯(HDPE)和聚甲基丙烯酸甲酯(PMMA) )。还研究了带缺口和抛光的PTFE不同表面处理对其击穿特性的影响。击穿后,将通过宏观和微观观察对损坏的电介质样品的照片进行分析。沿着微波电场的方向,在介电窗的上游面上出现了明显的树状击穿现象。不同的表面处理会严重影响损坏。认为树状击穿通道与所施加的微波场密切相关。在对透明的PMMA样品内部的树木破坏进行深入观察的基础上,发现树木沿着材料的表面以及内部生长。提出了一种物理模型来描述HPM下的介电窗击穿。建议电场导致树沿着材料表面发展。分析了树木入侵材料的可能原因。此外,提出了几种可能的方式来描述介电窗内部树的萌生和发展。

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