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首页> 外文期刊>IEEE Transactions on Dielectrics and Electrical Insulation >High Temperature Insulation Materials for DC Cable Insulation — Part I: Space Charge and Conduction
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High Temperature Insulation Materials for DC Cable Insulation — Part I: Space Charge and Conduction

机译:用于直流电缆绝缘的高温绝缘材料 - 第一部分:空间充电和传导

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Fundamental studies of potential candidates for DC electric power transmission in high temperature environment, including ETFE, FEP, PTFE, PI and PEEK, are carried out and presented in form of the series papers containing space charge and conduction as part I, partial discharge as part II, and the degradation and surface breakdown as part III. In this part, the space charge at 20kV/mm was measured at 25 degrees C and with a thermal gradient at 50 degrees C. The electrical conductivity was measured at electric fields ranging from 10kV/mm to 30kV/mm in temperatures ranging from 25 degrees C to 200 degrees C. The experimental results showed that considering the effect of thermal condition and electric field, FEP has the lowest total amount of space charge accumulation and electric field distortion among these materials at the measured conditions. PI and PEEK have the lowest amount of trap-controlled mobility at 25 degrees C due to deeper average trap level because of the aromatic rings in the structure. PTFE and PI have the lowest amount of thermal activation energy and temperature-dependent electrical conductivity due to the more uniform morphological phase comparing to ETFE, FEP, and PEEK. The outcomes of this paper serve as a benchmark for the fundamental researches over high temperature materials for DC applications and lay a basis for Part II and Part III.
机译:高温环境中DC电力传输潜在候选人的基本研究,包括ETFE,FEP,PTFE,PI和PEEK,并以含有空间充电和传导作为第一部分,作为一部分的部分放电的形式呈现。 II,作为第III部分的降解和表面分解。在该部分中,20kV / mm处的空间电荷在25℃下测量,并且在50℃下热梯度测量。在从25度的温度范围内的电场测量电导率在10kV / mm至30kV / mm。 C至200摄氏度。实验结果表明,考虑到热条件和电场的效果,在测量条件下,FEP在这些材料中具有最低总空间电荷积累和电场变形。由于结构中的芳香环,PI和PEEK由于平均捕获水平更深的平均陷阱水平,PI和PEEK具有25摄氏度的最低量。由于与ETFE,FEP和PEEK相比,由于更均匀的形态相位,PTFE和PI具有最低的热激活能量和温度依赖的电导率。本文的结果作为对直流应用的高温材料的基本研究的基准,并为第II部分和第III部分奠定基础。

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